GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany

GALLUNOPTIMAL Solder Tin ISO Core Soldering Wire Clear Sn100Ni+ Sn99.3CuNiGe 1 mm on 100 g Spool Made by Felder GmbH in Germany

ISO-Core Soldering Wire Sn100Ni+, Sn99.3CuNiGe, according to Fuji-Pat.-No DE19816671C2, melting point 227°C, with 2.2% flux content clear according to DIN EN 29454/1.1.3.B REL1 (F-SW32) 1.0 mm to 100 g. SpSp

Product Features

• This lead-free solder is ideal for electronics, whether for THD or SMD components.
• Its eutectic melting range is 227C, which ensures a low working temperature and reduces the thermal load on the components.
• This is a clear wire, which means cleaning the solder joints is not necessary, the flux residues are crystal clear
• The flux content is 2.2% REL1 (free from rosin / with halogen) which allows optimal wetting of the solder joint
• Alloy: Sn 99, 3CuNiGe/Box contents: 100 g spool with a wire diameter of 1 mm - produced for Gallunoptimal by Felder GmbH in Germany